Bettersize instruments provide the particle size distribution and particle shape analysis of silicon carbide, diamond, corundum and other materials.
Widely used, abrasive is the ‘teeth’ of the manufacturing industry. Silicon carbide powder is a type of milling material mainly used for multi-wire cutting machines, and its particle shape and particle size are vital for the degree of smoothness and cutting efficiency of silicon wafers. Silicon carbide powder is the essence of silicon wafer cutting. With an appropriate particle shape, the surface of the silicon wafers presents a good degree of smoothness after cutting. Cutting efficiency can be improved by narrowing the particle size distribution and making the corner angle sharper.